隔离产品无铅计划
随着市场和法规机构要求的不断提高，电子行业一直在努力提供无铅产品，以消除由于在焊接表面中使用铅(Pb)而给环境带来的不利影响。
目前，绝大部分的电子产品还是在印刷电路板上焊接半导体器件(采用锡(Sn)和铅(Pb))。法规机构和市场正在不断加大力度，促使供应商和客户在焊接表面中不再使用铅(Pb)，因为它会给人类环境带来有害影响。制造元器件的废水泄露到水源中，会产生大量的不利结果。因此，电子行业一直在不懈努力，识别和实现铅的替代品。
Avago Technologies隔离产品部郑重承诺，从2003年11月1日起在全部塑料隔离产品系列中提供无铅器件的选择。
查询无铅器件，请点击这里。
资料和下载
- 3.1.05 Application Bulletin
Recommended Reflow Profile for Avago Technologies's Lead-Free Plastic Isolation products - Recommended lead-free reflow profile. (50k, pdf) - 7.30.03 Regulatory Certificate
Avago Technologies Regulatory Guide for Plastic Isolation Products - Lead Free Reliability Tests - Avago Technologies Isolation Products Division conducts a variety of reliability stresses to qualify lead-free components. (46k, pdf) - 8.4.03 Business Reports
Avago Technologies Plastic Isolation Products - Frequently Asked Questions - Avago Technologies Plastic Isolation Products Frequently Asked Questions. (63k, pdf) - 3.31.05 CCN
PCN: A05-001-32002150-0A, Mar. 2005 - Labeling content and recommended lead-free soldering profile according to J-STD-020C. (281k, pdf) - 4.7.04 CCN
PCN: A04-003-32002150-0A, Apr. 2004 - PLEASE NOTE THAT GENERAL PURPOSE PHOTOTRANSISTOR OPTOCOUPLERS ARE OFFERED IN LEAD-FREE OPTION ONLY. The product listed above will be able to withstand higher reflow temperature (240 deg. C to 250 deg. C) and are lead-free compliant. (15k, pdf)
